FlipChip International
FlipChip International (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, Spheron WLCSP, ChipsetT Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, Arizona, USA, and Shanghai, China
FlipChip International
FlipChip International (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, Spheron WLCSP, ChipsetT Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, Arizona, USA, and Shanghai, China
flipchip.com
3701 E University Phoenix, Arizona 85034, US
Details
Year founded
2004
Revenue
75M-200M
Employees
501-1000
Number of locations
2
NAICS
3344
SIC
3674
Products & Services
Outlines the company's specialized services and operational strengths.
- Electronic Packages
- Engineering Services
- Flip Chip Services
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Equipment
Provides a detailed list of machinery and tools utilized on the company's premises.
- Wafer Thinning Machine (Mechanical Back-grinding)
- Backside Laminate Machine (Backside protective coating tapes and die attach films)
- Wafer Laser Marking Machine (Backside marking of wafer and individual die)
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Ramping up production
Indicates the company's current production trend and growth trajectory.
TRUE
Our production algorithm is showing that flipchip international is ramping up production.
Target industries
Employees working in FlipChip International
Locations (2)
FlipChip International
3701 E University Phoenix, Arizona 85034, US
FlipChip International
351 Gou Shou Jing Road Zhang Jiang Hi-Tech Park Pudong New Area, Shanghai 201203, CN
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Frequently Asked Questions
What services & capabilities does FlipChip International offer?
FlipChip International offers a range of services and capabilities, including Electronic Packages.
What kind of equipment does FlipChip International use?
FlipChip International uses a variety of equipment, including Wafer Thinning Machine (Mechanical Back-grinding).
What are the target industries of FlipChip International?
FlipChip International serves several industries, including the semiconductor industry.
How many locations does FlipChip International operate?
FlipChip International operates from 2 locations.
Where are the headquarters of FlipChip International?
The headquarters of FlipChip International are located in 3701 east university, phoenix, arizona 85034, united states.
What is the NAICS code for FlipChip International?
The NAICS code for FlipChip International is 3344.
How many employees does FlipChip International have?
FlipChip International has 537 employees.
What is the official website of FlipChip International?
The official website of FlipChip International is https://www.flipchip.com/.
When was FlipChip International founded?
FlipChip International was founded in 2004.