Grinding and Dicing Services Inc
The most experienced US supplier targeting complex wafer dicing and grinding services for diverse market segments including semiconductor, MEMS and life sciences to name a few. Continuity of support from NPI to commercial scale manufacturing for both commercial and military applications. Robust Static and Cleanliness controls capable of the most demanding specifications. GDSI is ISO 9001:2008 registered. Serving fab and fabless interests for over 20 Years. Why gamble with your material? Trust GDSI to process your critical projects. Specialties: Wafer dicing, Stealth Laser Dicing Process, wafer grinding, thinning, polish, inspection, wafer saw, SiC, Glass, Silicon, MEMS, pick & place, 300mm, Die Bonding
Grinding and Dicing Services Inc
The most experienced US supplier targeting complex wafer dicing and grinding services for diverse market segments including semiconductor, MEMS and life sciences to name a few. Continuity of support from NPI to commercial scale manufacturing for both commercial and military applications. Robust Static and Cleanliness controls capable of the most demanding specifications. GDSI is ISO 9001:2008 registered. Serving fab and fabless interests for over 20 Years. Why gamble with your material? Trust GDSI to process your critical projects. Specialties: Wafer dicing, Stealth Laser Dicing Process, wafer grinding, thinning, polish, inspection, wafer saw, SiC, Glass, Silicon, MEMS, pick & place, 300mm, Die Bonding
dieprepservices.com
925 Berryessa Rd San Jose, California, US
Details
Year founded
1992
Revenue
5M-10M
Employees
11-50
Number of locations
1
NAICS
3344
SIC
3674
Products & Services
Outlines the company's specialized services and operational strengths.
- Back Grinding & Polishing
- Finishing Services
- Grinding Services
- Contact us in order to access
Equipment
Provides a detailed list of machinery and tools utilized on the company's premises.
- Fully automated 300MM Disco machinery designed for precision and repeatability
- Individual chip grinding
- Wafer rounds up to 12” or 300MM
- Contact us in order to access
Ramping up production
Indicates the company's current production trend and growth trajectory.
FALSE
Our production algorithm is showing that grinding and dicing services is not ramping up production.
Target industries
Locations (1)
Grinding and Dicing Services Inc
925 Berryessa Rd San Jose, California, US
People Also Searched For
Frequently Asked Questions
What services & capabilities does Grinding and Dicing Services Inc offer?
Grinding and Dicing Services Inc offers a range of services and capabilities, including Back Grinding & Polishing.
What kind of equipment does Grinding and Dicing Services Inc use?
Grinding and Dicing Services Inc uses a variety of equipment, including Fully automated 300MM Disco machinery designed for precision and repeatability.
What are the target industries of Grinding and Dicing Services Inc?
Grinding and Dicing Services Inc serves several industries, including the semiconductor industry.
How many locations does Grinding and Dicing Services Inc operate?
Grinding and Dicing Services Inc operates from a single location at 925 berryessa road, san jose, california, united states.
Where are the headquarters of Grinding and Dicing Services Inc?
The headquarters of Grinding and Dicing Services Inc are located in 925 berryessa road, san jose, california, united states.
What is the NAICS code for Grinding and Dicing Services Inc?
The NAICS code for Grinding and Dicing Services Inc is 3344.
How many employees does Grinding and Dicing Services Inc have?
Grinding and Dicing Services Inc has 13 employees.
What is the official website of Grinding and Dicing Services Inc?
The official website of Grinding and Dicing Services Inc is https://www.dieprepservices.com/.
When was Grinding and Dicing Services Inc founded?
Grinding and Dicing Services Inc was founded in 1992.