Jet Process Corporation (JPC) is a privately held thin film deposition service founded in 1991, and is the sole owner and developer of the versatile Jet Vapor Deposition (JVD) process for thin film solders and other thin film metal coatings. We specialize in the deposition of lead free solders; these include eutectic and off-eutectic Gold-Tin, the Tin-Silver-Copper family, Indium and Indium alloys, and virtually all other lead free solder alloys. We also deposit related adhesion layers and diffusion barriers such as TiPtAu and TiNiAu. JVD's low temperature and low vacuum operating conditions are compatible with photoresist patterned wafers, heat sensitive substrates, and mask materials, including materials which outgas. JVD technology enables innovative and otherwise unavailable solutions for advanced technology applications such as semiconductor packaging, MEMS, microelectronics, optoelectronics, photonics, telecomm, microwave devices, advanced sensors, biomedical, aerospace, etc. JVD's low temperature, low vacuum operating conditions provide high rate deposition, high utilization of source material, and is a clean, environmentally sound operation that offers many advantages over competing thin film metalizing techniques such as sputtering, evaporation, CVD and electroplating, and has demonstrated its versatility in a wide variety of contract R&D and production work. JVD is an economical, safe, clean and environmentally sound process. In addition to our solder specialty, we have a recent and growing program in deposition of Platinum nanocluster films with high surface areas, for biomedical and other uses. CONTACT: 126 S. TURNPIKE RD., # 1C, WALLINGFORD, CT 06492 TEL: 203-985-6000