MicroSense has a singular focus on precision wafer measurement. MicroSense provides customers with state-of-the-art measurement performance in our products - Wafer Flatness Measurement Systems - thickness, flatness, bow and warp measurement of 200mm bare silicon wafers. MRAM Wafer Metrology - MOKE systems to characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM. Thin Film Stress Measurement Systems - systems measure the shape and thickness of the whole wafer pre- and post-deposition, generating full wafer local stress maps for deposition process control. Wafer Back Grind Thickness Measurement - systems monitor thickness and TTV of back grind wafers for process control of thinned wafers during grinding. Vibrating Sample Magnetometers to measure the fundamental magnetic characteristics of any sample. Precision capacitive sensors for nanometer resolution displacement measurement MicroSense provides customer value and security, through extensive business experience, financial strength, world-wide support, and technical leadership. MicroSense is part of KLA Corporation.