MPE, Inc. offers accurate and efficient wafer dicing and resizing services with fast turnaround. They specialize in custom wafer dicing and resizing for a wide variety of integrated circuits and devices, serving industries such as medical, military, academia, research, and semiconductor manufacturing. With a focus on quality and customer satisfaction, MPE utilizes innovative techniques like wafer coring and edge grinding to provide excellent cuts with minimal chipping. Their state-of-the-art facility in Texas allows them to process wafers up to 300mm in diameter and 10mm thick, catering to semiconductor firms of all sizes.