Nextreme was acquired by Laird Technolgies in February 2013. Nextreme designs and manufactures micro-scale thermal and power management products that overcome thermal and power constraints in electronics for applications in support of products for the telecom, consumer, test and measurement, industrial, automotive and government/aerospace markets. The company has patented thin-film embedded cooling technology and power generation capabilities that have been incorporated into the widely accepted copper pillar bumping process used in high-volume electronic packaging, making it very easy to integrate into current design processes and next generation product designs. By minimizing the need for manufacturing changes and focusing on developing a seamless design-in solution, Nextreme will change the future of thermal and power management for the entire electronics industry.