For more than 30 years, RH Murphy Co. has been designing and manufacturing innovative, high quality protective process and packaging products for the semiconductor industry. The products benefit from extensive knowledge of component handling, automation, conductive plastics, and plastics manufacturing. As technology has evolved, the same core competencies have been applied to a broad range of electronic components; modules, sensors, switches, coils, active and passive devices. When it comes to plastic application engineering, RH Murphy Co. has the expertise and ideas that are right for the times. Most exciting is our RapidTray Machined Tray Program, a unique "Prototype to Production" approach where low volume requirements are satisfied with short lead time, without investment in tooling. Starting with our universal platforms, we can generate custom solutions very quickly. As volume grows, the manufacturing process is optimized for cost and process efficiency with the option of global sourcing. RH Murphy Co.'s products include standardized JEDEC outline BGA matrix trays, PGA matrix trays, Machined matrix trays, Custom matrix trays, and ISOPAK test carriers, along with low cost component carriers and other protective packaging products. We also design and manufacture non-standard products to support both automated and manual processes. RH Murphy Co.'s engineering team provides program and product development and is ready to take on the most demanding challenges of your unique product requirements. Our 3D modeling capabilities and low volume manufacturing process allow us to quickly develop the optimal design to meet your requirements.