S-Bond Technologies is a materials technology company specializing in bonding solutions for a wide range of materials. They offer S-Bond active solders and soldering and brazing assembly services for applications in electronics, defense, aerospace, and industrial markets. With patented active solders and unique joining methods, S-Bond facilitates flux-free, low-temperature joining of dissimilar metals, ceramics, glasses, carbides, and composites. Additionally, they provide development, prototype, and production bonding services, along with Helium leak testing and ultrasonic C-Scan scanning services. S-Bond Technologies, led by Dr. Ronald Smith, has over 6,500 square feet of engineering and manufacturing space dedicated to providing bonding solutions and materials research for customers.