At Saras Micro Devices, we are transforming the way power is delivered to advanced semiconductor devices to maximize the computing power for cutting-edge, data-intensive applications like high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), virtual reality (VR), 5G networking and more. As packaging experts in the IC world, we understand your power delivery challenges and the technology behind them, and weve created a new way to power your innovations. Our novel approach for improving power delivery performance uses 25% less package space, provides clean stable power, and minimizes power waste to deliver better overall efficiency. When you need packaging expertise to help you reach your power management goals, let us help you power the future.