Semi Pac Inc. offers advanced packaging services and innovative process development for challenging projects, with a focus on medical product development. They specialize in wafer bumping, wire bonding, wafer sawing, wafer dicing, PCB wire bonding, die preparation, die inspection, and semiconductor packaging. Semi Pac Inc. has expertise in semiconductor packaging excellence and works with world-class clients, providing on-site assembly services, process development, and reliability expertise. Their patented next-generation ultra-low-cost wafer bumping technology ensures medical compliance and reliability in packaging for medical devices.