Thermocarbon has over 40 years of expertise in the dicing and precision diamond grinding industry. They offer ultrathin dicing blades and dicing saws for wafer slicing of thin silicon materials for fiber optics and semiconductors, as well as cutting heavy substrates like ceramics and quartz. Thermocarbon converts their experience into educational content to help clients understand complex dicing technology and improve dicing operations. They design, manufacture, and distribute dicing-blade compositions and saw blades, focusing on providing high-quality solutions for the industry.